Congress description

The 15th edition of the EURADH (European Adhesion Conference), along with the XXII biannual edition of the International Congress on Adhesion and Adhesives, will be held in Valencia (Spain) in October 2025. This event is organised by the Spanish Group on Adhesion and Adhesives (GEAA) in collaboration with the Spanish Association of Adhesive and Glue Manufacturers (ASEFCA).

In this edition, the event will span three days and will serve as the principal forum for the exchange of knowledge and technology among specialised professionals, adhesive manufacturers, and users who are interested in learning about technological advances, the latest market developments, and applications in adhesive bonding technology.

The conference covers all aspects of the science and technology of adhesion and adhesives, including:


Surface preparation for tuning bonding: cleaning, functionnalization

Surface properties: friction and adhesion, wettability and surface/interface interactions


Friendly structural and soft adhesives, smart adhesives, biomass derived adhesives, stimulus sensitive adhesives, sustainable adhesives and coatings, nanotechnology


Medical applications, biomimetics, biofilms

Soft matter

Gel and elastomer adhesion, rheology and adhesion

Fracture mechanics: analytical and numerical approaches


Durability of interfaces: ageing, fatigue, creep…

Recyclability, dismantling, healing or self-healing of bonded structures

Structural bonding

Adhesion testing, including non-destructive and high rates

Bonding design and fracture mechanics

Advances in process

Organic additive manufacturing: structural and soft materials

Composite joining, welded assemblies

Novel tools

Methods for characterization of interfaces, interphases, surfaces and multimaterials at different scales

Quality procedures, non-destructive testing and standardisation

In this consolidated edition, the aim is to extend participation to the industrial network that already uses adhesive solutions in its manufacturing processes or seeks to improve its solutions with the latest market innovations. Moreover, there will be an opportunity to present proposals to participate in the congress with practical and real examples where their sharing will be of great interest to all industrial sectors in which adhesive bonding has become a facilitating technology for innovative and sustainable manufacturing.

Authors who wish to make a presentation (oral or poster) are requested to submit an abstract (up to 3 A4 pages possibly with a diagram and references) in English, by 11 April 2025. The abstracts should be sent electronically to This email address is being protected from spambots. You need JavaScript enabled to view it. . The abstract template can be downloaded from this link.

Abstract template

Conference proceedings with the accepted abstracts (book of abstracts) will be available at the registration. The book of abstracts will have an ISBN number.


Deadline for submission of abstracts:
11 April, 2025

Notification of acceptance to authors:
18 April, 2025

Early bird registration
30 May, 2025



Registration fees:


Regular delegate

 650 €

Student (MSc or PhD)*

550 €


450 €

Standard registration

Regular delegate

 800 €

Student (MSc or PhD)*

700 €


600 €

*Students: must attach a copy of their student card or accreditation certificate to benefit from this fee.

The conference fee includes book of abstracts, lunches, conference dinner, coffee-breaks and reception first day.

To register for the Congress, please complete the electronic registration form below.


EURADH / International Congress on Adhesion and Adhesives 2025

International Scientific Board

Euradh Representatives

Arán Ais, Francisca - INESCOP, Alicante/E

Bordado, João M. - University of Lisbon/P

da Silva, Lucas F.M. - Faculty of Engineering of the University of Porto/P

Dalla Zuanna, Cyrille - CETIM Saint Etienne/F

del Real Romero, Juan Carlos - Universidad Pontificia Comillas, Madrid/E

Hartwig, Andreas - Fraunhofer IFAM, Bremen/D

Jumel, Julien - ENSTA Bretagne, Brest/F

Kellar, Ewen - TWI, Cambridge/UK

Oosting, Richard - Rich-Bond S.A.C., Schijndel/NL

Paul, Florian - DECHEMA e.V., Frankfurt am Main/D

Stammen, Elisabeth - ifs, TU Braunschweig, Aachen/D

Taylor, Ambrose C. - Imperial College, London/UK

Vrenken, Jurgen - Tata Steel, Ijmuiden/NL

International Congress on Adhesion and Adhesives Representatives

Abenojar Buendia, Juana - Carlos III University of Madrid

Arán Ais, Francisca - Geaa/Inescop

Blanco, Gema - Sika

de la Flor, Silvia - Rovira I Virgili University

del Real Romero, Juan Carlos - Pontificia Comillas University

Flórez, Sonia - Tecnalia

Martínez Casanova, Miguel Ángel - University Carlos III of Madrid

Orgilés Calpena, Elena - Inescop

Ruzafa Silvestre, Carlos - Asefca/Inescop

Sánchez Lozano, Miguel - Miguel Hernández University of Elche

Congress programme











The poster size must be 800 mm x 1000 mm in portrait orientation.The text and illustrations must be legible from a distance of two metres. Tacks and technical equipment for mounting the posters will be provided. Please consult the final conference programme when it is available for your assigned poster board number. Your poster should be displayed according to the number indicated in the programme.


Venue of the congress:

Information not aivalable


Information not available


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